NSC-6017 Industrial Network Appliance

● Fanless Rackmount Industrial Network Appliance
● Intel® Skylake C236 Chipset
● 6 x GbE RJ45 Ports, 2 x GbE SFP Ports
● Supports 3 Pairs of Bypass (Gen3), 2 x NIC Expansion Modules
● Supports 4G/5G + WiFi
● DDR4 ECC/Non-ECC Memory, up to 64GB
● Supports CF, SATA, mSATA
● Complies with EMC, RoHS, CE, FCC Certifications


·Platform

CPU6th/7th/8th/9th Gen Intel®  Celeron/ Pentium/CORE/Xeon Processor

BIOSUEFI

ChipsetIntel® Skylake C236

·RAM

TypeDDR4 1866/2133 MHz DIMM ECC/Non-ECC

CapacityMAX. Capacity 64GB

Memory Slot2 x DDR4 288-pin DIMM

·Network

Port6 x GbE RJ45, 2 x GbE SFP

Network Chipset: 6 x Intel® I210-AT/I211-AT, 2 x Intel® I210-AS

Bypass3 Pais optional (Gen3), LAN1~LAN2, LAN3~LAN4, LAN5~LAN6

·Expansion

      NIC Expansion: 2 x NIC expansion modules

miniPCIe1 x miniPCIe

SIM Card1 x SIM card slot (optional)

M.2: 1 x M.2 3042/3052 for 5G 

4G/WiFiSupported (optional)

·I/O Interface

Console: 1 x RJ45 Console port (compatible with Cisco-defined), 1 x onboard pin header

USB: 2 x 3.0 USB, 2 x USB 2.0 pin headers (1/2)

Display1 x VGA ports (optional)

GPIO8

·Storage

SATA4 x SATA3.0(supports 2.5'' hard disk)

mSATA1 x mSATA

CF Card1 x TypeII CF Card

·Power

Power SupplyAC 90~264V @ 47~63Hz, 150W single power / 150W dual power (optional)

·Control & Signal

Indicator1 x HDD, 1 x Power, 1 x GPIO, 3 x Bypass (optional)

Reset Button: 1 x Reset button

·Cooling

Cooling MethodFanless design

·Mechanical & Environmental

Dimensions: 1U Rackmount, 440 x 560 x 44 mm (W x D x H)

Operating Temperature-20°C~60°C(-4°F~140°F)

Storage Temperature-20°C~70°C(-4°F~158°F)

Storage Humidity10~95%, non-condensing

PackageDouble-layer packaging (customized)

·System & Software

OSLinux & Windows

Software: GPIO/Bypass/Watchdog sample code provided

·Certifications

CertificationsCompliance with EMC, RoHS, CE, FCC

 

    

Note: Product specifications listed are subject to updates and improvements without prior notice.




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